Diamond wheel for back side grinding of silicon sapphire wafer
Product Description
As the professional manufacture, we would like to provide you Diamond wheel for back side grinding of silicon sapphire wafer. And we will offer you the best after-sale service and timely delivery.
Product Detail
Buy Customized Diamond wheel for back side grinding of silicon sapphire wafer In Stock
Application:
Used for back side thinning and front side precision grinding of silicon sapphire wafer.
Features:
1、various directions of producing chemicals or metallurgical products. Provide with high efficiency of grinding and durable lifetime.
2.stably manufacture technics. Provide with fine roughness of wafer surface.
Specification:
Bond: resin, metal,vitrified.
External diameter: Φ 250 Φ 255 Φ 300 Φ 380, etc.
Grit size:180#～400#
Applicable equipment:
Be used on machines manufactured by NTC, SPEEDFAM,GALAXY,etc.